Develop high-performance products: In response to the development trend of miniaturization and thinning of electronic products, develop adhesive and potting materials with characteristics such as high bonding strength, low viscosity, and rapid curing to meet the needs of bonding electronic components and packaging circuit boards.
Reliability testing: Establish a complete product reliability testing system to test the performance of adhesive and potting materials under different environmental conditions such as high temperature, high humidity, and vibration to ensure the stability and reliability of products in electronic devices.
Cooperate with electronic equipment manufacturers: Establish long-term cooperative relationships with electronic equipment manufacturers such as mobile phones, computers, and televisions. Provide customized adhesive and potting solutions according to their product needs and jointly develop new products.