Heat Management Materials Products

The ST1950, a high thermal conductivity phase change material (PCM) in the 1900 series, is available in both pad and phase change sheet configurations. Designed to reduce interfacial thermal resistance, it has passed reliability tests while maintaining superior performance. This material demonstrates excellent interfacial wettability across typical operating temperature ranges, resulting in extremely low surface contact resistance.

ST-TF40 is a composite film based on two-dimensional boron nitride nanosheets. This thermal management film exhibits outstanding properties including electromagnetic wave transmission, high thermal conductivity, flexibility, insulation, low dielectric constant, low dielectric loss, compatibility with single/double-sided adhesive, and die-cutting capability for any shape. It is currently recognized as the most effective thermal management material in 5G RF chips and millimeter-wave antenna applications.

Thermal conductive adhesive is primarily used to facilitate heat transfer between materials, transferring heat from high-temperature zones to low-temperature zones to achieve effective heat dissipation and extend component lifespan. With the widespread adoption of new energy power batteries and energy storage batteries, coupled with advancements in traditional electronic component processing capabilities and the trend toward smaller, more compact electronic modules, the demand for efficient heat dissipation has significantly increased. Thermal conductive materials provide long-term, reliable protection for sensitive circuits and components in harsh environments.

Product Overview: Thermal conductive adhesive is primarily used to facilitate heat transfer between materials, transferring heat from high-temperature zones to low-temperature zones to achieve effective heat dissipation and extend component lifespan. With the widespread adoption of new energy power batteries and energy storage batteries, coupled with advancements in traditional electronic component processing capabilities and the trend toward smaller, more compact electronic modules, the demand for efficient heat dissipation has significantly increased. Thermal conductive materials provide long-term, reliable protection for sensitive circuits and components in harsh environments.