LIFT OFF photoresist

ST-PR-3L1/2 series

• ◎ Broadband line,i-,h-,g-line
  ◎ UV-curing negative adhesive, used in release processes
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ST-PR-3L3/4 series

• ◎ High-sensitivity i-line negative film
  ◎ Heat-resistant, used in peeling processes
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ST-PR-3L5/6 series

• ◎ As the base layer adhesive or sacrificial layer in the dual-layer process
  ◎ Compatible with conventional positive photoresist
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