Light Sensitive Dielectric Material

type

model

film thickness /um

(after cure)

Applicable process

Reagent kit

BCB

ST-PS-135

1—2.4

dry etching molding;

Applied to dielectric materials, bonding processes, etc.

Adhesive: AP3000

Cleaning agent: T1100

Developing solution: DS2100 (spin) / DS3000 (immersion)

Remover: StripperA

ST-PS-146

2.4-5.8

ST-PS-157

5.7-15.6

ST-PS-163

9.5-26

ST-PS-235

2.5-5

negative photosensitive BCB

It is widely used as a dielectric layer or passivation layer in IC, MEMS, optoelectronics, and other fields.

ST-PS-240

3.5-7.5

ST-PS-246

7-14

PI

We offer products from various well-known brands.

1-20

Please call for details!