Negative Photoresist

Product overview

A cross-linking reaction occurs in the exposed area and is insoluble in the developer, forming a negative image pattern. It has good etching resistance and electroplating resistance, and is widely used in integrated circuits, advanced packaging and microelectromechanical systems (MEMS) manufacturing processes.

Core features

 - High sensitivity

 - Excellent line width control

 - Good adhesion

 - Low defect density

Application areas

 - Semiconductor packaging

 - MEMS device

 - Advanced packaging

 - Wafer level packaging

Product pictures