Solid Glue

Product overview

Die bonding adhesive is a high-precision bonding material specifically used to securely attach chips to substrates in semiconductor packaging. It has excellent thermal stability, high bonding strength and low ionic content, ensuring that the chip works stably in high temperature and high humidity environments. The curing method is flexible (thermal curing or UV curing) to meet the needs of different production lines. It is widely used in the packaging of microelectronic devices such as LEDs, ICs, and sensors, and is a key material to improve the reliability of electronic equipment.

Core Features:

 - High bonding strength

 - Excellent electrical and thermal conductivity

 - Low curing temperature, high reliability

 - Wide process window

Application areas: 

 - Power device packaging

 - LED packaging

 - RF module

 - Automotive electronic sensors

Product pictures: