0102030405
ST-2562 Epoxy Conductive Adhesive Silver Glue
Product Introduction
- This adhesive is a two-component silver paste composed of modified epoxy, modified amine, and silver powder. The conductive adhesive prepared in the specified ratio exhibits stable performance, high bonding strength, simple processing, and room-temperature curing, with optional heating for curing. The volume resistivity ranges from 10^-3 to 10^-4 Ω·cm.
Widely used in the electronic and electrical industries for the conductivity of metals, ceramics, glass, electrodes, and thin-film resistors.
Can bond.
performance index ：
|
condition of cure |
25°C for 24 hours, or 60°C for 2 hours, or 90°C for 60 minutes |
|
shear Al-Al |
＞50 kg/cm2 ＞80 kg/cm2 ＞80 kg/cm |
|
mass resistivity |
5.0*10 -3Ω·cm 3.0*10 -4Ω·cm 3.0*10 -4Ω·cm |
|
working temperature |
-55℃~200℃ |
Operation procedure:
1. Stir Group A for 3-5 minutes until it forms a homogeneous viscous mass.
2. Mix uniformly in a ratio of A:B=10:1 (by weight).
3. Apply the aforementioned colloid to the two components requiring bonding, with a thickness of 0.1–0.2 mm. Subsequently, assemble the two components.
Secure with a clamp.
4.25℃ curing for 24 hours is acceptable, or alternatively, 60℃ for 2 hours or 90℃ for 60 minutes.