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ST-6606 Thermal Conductive Filling Compound
Product Introduction
- This product is a two-component silicone potting compound that fully complies with the EU RoHS Directive and SVHC REACH requirements. Upon mixing, it undergoes an addition reaction to form a high-performance elastomer, primarily used in harsh environments requiring waterproofing, moisture resistance, corrosion resistance, and shock absorption. The curing speed is adjustable, and deep curing is unaffected by environmental conditions. It exhibits excellent thermal conductivity and electrical insulation properties.
Ideal for heat dissipation of internal components in high-power devices, integrated circuit boards, EV charging pile modules, lithium battery packs, photovoltaic inverters, and LED power driver modules. It also excels in casting and potting for large-area and deep-sealed components, offering superior insulation and sealing performance. The material demonstrates excellent electrical properties and high-temperature resistance.
performance index ：
| Viscosity (cps, 25°C) | A:15000±1000 B:16000±1000 |
| Relative density (MPa.s) | 2.6 ~ 2.7 |
| Mixture ratio (A:B) | A：B=1：1 |
| Post-mixing viscosity (cps, 25°C) | 15000~16000 |
| Post-mixing operation time (25°C) | 40 minutes |
| Post-mixing surface drying time (25°C) | 1-2 hours |
| Curing conditions (heating-curing) | 25°C/8 hours or 80°C/30 minutes |
| Hardness (Shore A, 24 hours) | 30±5 |
| thermal conductivity (W/mK) | ≥2.5 |
| Volume resistivity (Ω·cm) | 1.0×10^14 |
| Electric constant (60Hz) | 3.5 |
| Temperature range (°C) | -60~250 |
The operation time and curing time were tested with a glue amount of 100g. All data of the cured state were measured after 5 days of glue curing under conditions of 25°C and 55% RH.
Usage Method ：
(1)Weighing: Accurately weigh components A and B, mix them thoroughly in a 1:1 (mass) ratio, and stir each component separately before weighing to ensure homogenization and allow for sedimentation.
(2)Mastication: The adhesive material is thoroughly mixed uniformly by hand or machine to achieve a homogeneous color. When using manual filling, the initial mixing quantity should not be excessive to avoid reduced fluidity during subsequent filling.
(3)Defoaming: The uniformly mixed rubber compound is placed in a vacuum chamber for defoaming, where vacuum extraction removes air entrained during mixing.
Filling: Pour the degassed rubber compound into the device to complete the encapsulation process. Prior to filling, ensure both the device surface and mixing container are clean and dry.
(4) Curing: The encapsulated device should be cured at room temperature. The viscosity of the mixed colloid will gradually increase over time, and it is important to control the process within the operational time frame.
Safety precautions:
1. The sizing and curing processes must not be conducted in a sealed environment; adequate ventilation should be maintained.
2. Avoid contact with eyes during application of sizing; in case of colloid eye contact, rinse thoroughly with copious water and seek immediate medical attention; for additional safety data, refer to the product safety data sheet.
3. Some materials, chemical agents, curing agents and plasticizers can inhibit the curing of ST-6606 potting silicone rubber.
4. Before large-scale use, test a small amount first to master the product's usage techniques and avoid mistakes.