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ST-CA1200 Thermal Conductive and Electrical Conductive Adhesive

Conductive adhesive features include:

  1. Excellent adhesion, demonstrating strong bonding capacity to various substrates
  2. Excellent and stable electrical conductivity
  3. Rapid drying time for more efficient operation
  4. Single-component curing at room temperature with humidity, convenient for use
  5. Excellent resilience with outstanding recovery performance under repeated compression deformation, capable of withstanding compression rates up to 35%.

    Product Introduction

    • Conductive adhesive features include:
      1. Excellent adhesion, demonstrating strong bonding capacity to various substrates
      2. Excellent and stable electrical conductivity
      3. Rapid drying time for more efficient operation
      4. Single-component curing at room temperature with humidity, convenient for use
      5. Excellent resilience with outstanding recovery performance under repeated compression deformation, capable of withstanding compression rates up to 35%.
    • ST-CA1200
    Ideal for large-scale rapid operations in the electronics industry, including photovoltaic panel lamination assembly, electromagnetic wave shielding gasket molding, microelectronics assembly, special device connections, welding alternatives, and other conductive applications.
    2

    performance index :

    product model

    ST-CA1200

    Hardness (Shore D)

    70±5

    Tensile strength (MPa)

    ≥2.0

    Shear strength (MPa)

    ≥2.0

    elongation at break (%)

    ≥10

    thermal conductivity (W/m·K)

    1.00

    Volume resistivity (Ω·cm)

    10^-4

    Flame retardant rating (UL94)

    V-0

    Construction process recommendations:

    1. Cleaning: Remove dust, water, and oil stains from the product surface, and maintain dryness.
    2. Mixing: Before proportioning, first stir Agent A to incorporate the pigment (filler) that has settled at the bottom into the adhesive solution.
    3. Mixing ratio: Weigh the ingredients according to the A/B ratio of the purchased product and pour them in sequentially (*Note: Use weight ratio, not volume ratio).
    4. Mixing: Thoroughly mix the prepared A/B adhesive to prevent incomplete curing.
    5. Defoaming: After mixing and stirring the adhesive, let it stand for 5-10 minutes to allow natural elimination of bubbles. If conditions permit, vacuum defoaming may be performed.
    6. Application of adhesive: Pour the degassed adhesive into the product requiring adhesion, and use it within the recommended time frame.

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