ST-CF1500 Coating Adhesive
Product Introduction
- ST-CF1500 is an alkyd resin-modified polyurethane electrical sealant, designed for coating protection in thick-film circuit systems, porous substrates, and printed circuit boards. This specialized formulation safeguards PCBs and associated equipment against environmental degradation, featuring excellent high/low-temperature resistance and forming a transparent film upon curing.
Protective circuit boards in the electronics industry; protection of electronic components and wiring harnesses in the automotive industry; aerospace-protected electronic equipment; protection of control devices in industrial applications; and protection of related equipment in the new energy sector.
This product has the following features:
1) Excellent protective properties, effectively blocking dust, moisture, etc.;
2) Excellent insulation to prevent short-circuit and leakage;
3) Excellent flexibility, capable of withstanding stress and vibration;
4) High transparency for easy observation of components;
5) High chemical stability and resistance to chemical erosion;
6) Excellent curing properties with rapid and controllable curing;
7) It has good thermal stability and can adapt to certain temperature changes;
performance index ：
|
product model |
ST-CF1500 |
|
Density (g/cm3) |
1.0±0.1 |
|
Viscosity (MPa·s) |
100-150 |
|
water absorption （%） |
0.01 |
|
Dielectric strength (kV/mm) |
19.0 |
|
Dielectric constant (@1MHz) |
3.0-3.5 |
|
Dielectric loss factor (@1MHz) |
0.035 |
|
Volume resistivity (Ω·cm) |
3.5x10^14 |
|
Adhesion (Hutchins test) |
Level 1 |
|
solid content |
52±3% |
|
Double 85 test |
pass through |
Construction process recommendations:
1. Cleaning: Remove dust, water, and oil stains from the product surface, and maintain dryness.
2. Mixing: Before proportioning, first stir Agent A to incorporate the pigment (filler) that has settled at the bottom into the adhesive solution.
3. Mixing ratio: Weigh the ingredients according to the A/B ratio of the purchased product and pour them in sequentially (*Note: Use weight ratio, not volume ratio).
4. Mixing: Thoroughly mix the prepared A/B adhesive to prevent incomplete curing.
5. Defoaming: After mixing and stirring the adhesive, let it stand for 5-10 minutes to allow natural elimination of bubbles. If conditions permit, vacuum defoaming may be performed.
6. Application of adhesive: Pour the degassed adhesive into the product requiring adhesion, and use it within the recommended time frame.