ST-HC 2533 Heat Conducting Adhesive
Introduction
Use
Parameters
|
Type |
ST-HC 2533 |
|
Hardness (Shore D) |
85±5 |
|
Glass transition temperature (℃) |
120 |
|
Shear strength (MPa) |
>22.0 |
|
Elongation at break (%) |
<3 |
|
Linear coefficient of thermal expansion (ppm/℃) |
50~150 |
|
Volume resistivity (Ω·cm) |
1.0x1014 |
|
Thermal conductivity (W/m·K) |
4.5 |
|
Water absorption rate (%) |
≤0.2 |
Construction Recommendations
Cleaning: Clean dust, water, oil and other substances on the product surface and keep the surface dry.
Stirring: Before proportioning, stir Agent A first to distribute the pigments (fillers) sinking to the bottom into the glue solution.
Proportioning: Weigh respectively according to the A/B ratio of the purchased product and pour in sequentially (*Note: According to weight ratio, not volume ratio).
Mixing: Stir and mix the proportioned A/B glue, and stir fully to avoid incomplete curing.
Defoaming: Let the mixed and stirred glue stand for 5-10 minutes, and the bubbles will be automatically discharged. If possible, vacuum defoaming can be performed.
Applying glue: Pour the defoamed glue into the product that needs glue. Please use it up within the operable time.