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ST-PE1700 Thermal Conductive Sealant

Santam Technology's high-strength elastic potting compound overcomes the drawbacks of conventional epoxy resin brittleness and silicone resin's low strength and poor adhesion. It features exceptional strength and toughness, acid/alkali resistance, salt spray corrosion resistance, and high/low-temperature impact resistance with moisture protection. Having passed the dual 85 test, it offers superior insulation performance, environmental friendliness, and high cost-effectiveness, making it the ideal potting material for electronic components.

    Product Introduction

    • Santam Technology's high-strength elastic potting compound overcomes the drawbacks of conventional epoxy resin brittleness and silicone resin's low strength and poor adhesion. It features exceptional strength and toughness, acid/alkali resistance, salt spray corrosion resistance, and high/low-temperature impact resistance with moisture protection. Having passed the dual 85 test, it offers superior insulation performance, environmental friendliness, and high cost-effectiveness, making it the ideal potting material for electronic components.
    • ST-PE1700
    Our product portfolio caters to diverse customer needs, with customized solutions tailored to specific requirements. Our extensive expertise enables prompt responses to client demands. All products are UL-certified and ROHS-compliant, with dedicated solutions for every potting application.

    This product has the following features:

    1. Forms a tough elastomer after curing
    2. Moderate strength, water-resistant, mold-resistant, shockproof, with excellent
    3. Flame retardancy rating meets UL94 V-0
    Application: Electronic component encapsulation, such as integrated circuits; electrical equipment sealing, such as transformers; protective function in automotive electronics, aerospace, and communication equipment.
    3

    performance index :

    product model

    ST- PE 1700

    Viscosity (MPa·s)

    A:1000-2000

    B:3500-5000

    Volume ratio

    1:2

    Density after mixing (g/cm3)

    2.4±0.1

    thermal conductivity (W/m·K)

    1.5

    Tensile strength (MPa)

    ≥6.0

    elongation at break (%)

    20%

    Hardness (Shore A)

    70

    Dielectric strength (kV/mm)

    ≥15

    Volume resistivity (Ω·cm)

    ≥ 1.5x10^13

    Salt Spray Test

    pass through

    Flame retardant (UL94)

    V0

    Operation time (min)

    30

    Construction process recommendations:

    1. Cleaning: Remove dust, water, and oil stains from the surface of the product to be filled and sealed, and ensure the surface remains dry.
    2. Mixing: Before proportioning, first stir Agent A to incorporate the pigment (filler) that has settled at the bottom into the adhesive solution.
    3. Mixing ratio: Weigh the ingredients according to the A/B ratio of the purchased product and pour them in sequentially (*Note: Use weight ratio, not volume ratio).
    4. Mixing: Thoroughly mix the prepared A/B adhesive to prevent incomplete curing.
    5. Defoaming: After mixing and stirring the adhesive, let it stand for 5-10 minutes to allow natural elimination of bubbles. If conditions permit, vacuum defoaming may be performed.
    6. Pouring: Pour the degassed rubber compound into the product requiring adhesive application. Use within the recommended timeframe.

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