0102030405
ST-PE3430 Thermal Conductive Filling Compound
Product Introduction
- ST-PE3430 is a two-component silicone thermal conductive potting compound with thermal conductivity up to 3.0W without powdering. It exhibits excellent flowability after mixing, and its curing time can be adjusted according to temperature. The compound achieves deep curing at room temperature, making it suitable for potting and protecting various heat-dissipating and temperature-resistant components. It fully complies with the EU RoHS Directive and REACH requirements.
Automotive electronics and modules; LED power driver modules; solar panel junction boxes; electric vehicle charging pole modules; lithium battery packs and capacitor banks; magnetic induction coils; inverter power supplies.
performance index ：
|
dynamic viscosity ，mpa，s |
flexible elastomer |
|
surface drying time |
60-80 min |
|
mixing ratio |
100:100 |
|
Viscosity at 23°C |
13000±3000 |
|
Thermal conductivity W/(m·K) |
3.0 |
|
Hardness: Shore A0 |
50A |
|
Dielectric strength (kV/mm) at 25°C |
7.0 |
|
Dielectric constant (1 MHz) (25°C) |
5.4 |
|
Volume resistance (DC500V) Ω·cm |
>2.0×10^13 |
Construction process recommendations:
1. Cleaning: Remove dust, water, and oil stains from the surface of the product to be filled and sealed, and ensure the surface remains dry.
2. Mixing: Before proportioning, first stir Agent A to incorporate the pigment (filler) that has settled at the bottom into the adhesive solution.
3. Mixing ratio: Weigh the ingredients according to the A/B ratio of the purchased product and pour them in sequentially (*Note: Use weight ratio, not volume ratio).
4. Mixing: Thoroughly mix the prepared A/B adhesive to prevent incomplete curing.
5. Defoaming: After mixing and stirring the adhesive, let it stand for 5-10 minutes to allow natural elimination of bubbles. If conditions permit, vacuum defoaming may be performed.
6. Pouring: Pour the degassed rubber compound into the product requiring adhesive application. Use within the recommended timeframe.