ST-TF40 Thermal Conductive Film

ST-TF40 is a composite film based on two-dimensional boron nitride nanosheets. This thermal management film exhibits outstanding properties including electromagnetic wave transmission, high thermal conductivity, flexibility, insulation, low dielectric constant, low dielectric loss, compatibility with single/double-sided adhesive, and die-cutting capability for any shape. It is currently recognized as the most effective thermal management material in 5G RF chips and millimeter-wave antenna applications.

product details

Product Introduction

Conductive adhesive features include:
1. Excellent adhesion, demonstrating strong bonding capacity to various substrates
2. Excellent and stable electrical conductivity
3. Rapid drying time for more efficient operation
4. Single-component curing at room temperature with humidity, convenient for use
5. Excellent resilience with outstanding recovery performance under repeated compression deformation, capable of withstanding compression rates up to 35%.

1、RF antenna, Bluetooth chip, wireless communication, etc.
2、Lithium battery BMS and gallium nitride charger;
3、Unmanned aerial vehicle (UAV), motion camera, surveillance camera;
4、5G smartphones, smartwatches, and similar devices.

performance index ：

thermal conductivity	15W/(m·K)
thickness	0.5-5mm
density	3.2 g/cc
electric breakdown strength	＞5 kV/mm
mass resistivity	＞10^12Ω·cm
temperature range	-40~150℃

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