Underfill Glue

Product Overview

Underfill is a key protective material in flip chip packaging. It fills the gap between the chip and the substrate through capillary action, effectively relieving thermal stress concentration and improving solder joint reliability. Our products have the characteristics of ultra-low viscosity, fast flow, and low CTE matching, and are suitable for various advanced packaging forms such as CSP and BGA.

Core Features

 - Ultra-low viscosity

 - Fast capillary flow

 - Low CTE

 - High Tg temperature

 - Excellent reliability

Application areas

 - Flip Chip packaging

 - CSP packaging

 - BGA packaging

 - SiP system-in-package

 - 3D packaging

Product pictures