UV positive photoresist

ST-PR101 series

• ◎ Excellent adhesion and uniformity
  ◎ Suitable for micro-scale machining
  ◎ For dry and wet process technologies
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• Figure: ST-PR101 spin coating rotational speed versus thickness curve
• Figure: Resolution of ST-PR101 after development and exposure

ST-PR102 series

• ◎ High-resolution, high-adhesive positive resin
  ◎ Applicable to both dry etching and wet etching processes
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Figure: ST-PR102 spin coating rotational speed versus thickness curve

ST-PR103 series

• ◎ Excellent adhesion and verticality
  ◎ Applicable to wet etching and dry etching processes
  ◎ Suitable for electroplating processes
  ◎ Widely used in MEMS and Bump processes
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Figure: ST-PR103 spin coating rotational speed versus thickness curve

ST-PR107 series

• ◎ High-resolution, high-adhesive positive resin
  ◎ Applicable to both dry etching and wet etching processes
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• Figure: ST-PR107 spin coating speed-thickness curve
• Figure: Resolution of ST-PR107 after development and exposure